Agora has launched its Convo AI Device Kit, a turnkey solution for integrating conversational voice AI into smart devices and toys. This kit leverages Agora's conversational AI technology integrated with RiseLink's high-performance IoT chip modules to enable real-time, AI-driven conversations. The product allows developers to embed voice AI with features such as real-time speech-to-text, text-to-speech, and custom LLM integration.
The Convo AI Device Kit shifts the conversational AI bottleneck from cloud-only processing to an integrated edge-hardware solution. By providing pre-integrated chipsets, Agora significantly reduces the engineering friction for OEMs attempting to embed low-latency voice agents directly into physical hardware rather than relying on complex, multi-vendor software stacks. This move positions Agora as a critical infrastructure layer in the smart toy market, which is leaning heavily into AI-driven emotional companionship. As hardware manufacturers search for ways to differentiate static toy IP, watch for rising adoption rates among educational robotics firms and the deployment of purpose-built LLM 'eye' displays as a standard feature in connected devices.
Agora first introduced the Convo AI Device Kit in March 2025, initially partnering with chip-maker Beken to deliver an all-in-one toolkit for voice-driven interactions in smart devices and toys. The company demonstrated the kit powering Robopoet's AI companion robot Fuzzoo at Mobile World Congress, where the device used Robopoet's Multimodal Emotion Model to offer personalized emotional support through real-time listening, sensing, and responding. Tony Zhao, CEO of Agora, framed the expansion as a move to make robots and AI-driven toys "truly interactive, engaging, and intuitive" by embedding conversational AI directly into edge silicon rather than relying solely on cloud processing.
By September 2025, Agora had significantly upgraded the kit with its R1-4G revision, adding native global 4G connectivity via Nano-SIM and eSIM support across North America, Latin America, Europe, India, the Middle East, China, and Southeast Asia. Robopoet's CTO Yuna Pan confirmed that the upgraded kit powers their Fuzozo companion line, citing ultra-low latency voice interactions and global connectivity as critical for mobile AI devices that need to respond instantly whether at home or on the go.
The Convo AI Device Kit's architecture uses hybrid processing, where latency-sensitive audio processing and wake-word detection run locally on the device while advanced conversational reasoning is handled through connected cloud AI services. Agora's product page specifies compatibility with a wide range of ASR, TTS, and LLM providers as well as Wi-Fi, Cat.1, and ISP chipsets, giving OEMs flexibility in deployment without locking them into a single model vendor. The kit targets five primary use cases: educational STEM toys, emotional companionship devices, interactive play toys with voice and touch, smart home voice agents, and AI-powered wearables.
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