ZutaCore raises $100M for waterless cooling amid surging AI chip power
ZutaCore has raised $100 million in funding from investors including Mitsubishi Electric and Samsung to scale its waterless liquid cooling technology. The HyperCool system is designed for AI and high-performance computing data centers to handle processors exceeding 4,000 watts, reducing cooling energy consumption by approximately 50%. This Series C funding will support global commercialization, R&D, and megawatt-class deployments.
Key Takeaways
- ZutaCore raised $100 million in Series C funding from Mitsubishi Electric, Carrier Ventures, and Samsung Venture Investment Corp.
- The HyperCool system utilizes two-phase, direct-to-chip liquid cooling to manage AI processors drawing over 4,000 watts.
- The technology eliminates water consumption for cooling and reduces energy use by approximately 50% compared to conventional setups.
- Funding supports global commercialization, R&D, and megawatt-class deployments for ZutaCore.
- ZutaCore released the OmniTherm cold plate, compatible with Nvidia's RTX PRO 6000 Blackwell Server Edition in a single-slot PCIe form factor.
Why It Matters
The $100M raise for ZutaCore underscores the escalating infrastructure challenge posed by next-generation AI processors, which often exceed 4,000 watts and are pushing traditional cooling methods past their limits. This investment signals a critical need for new thermal management solutions, particularly as data center operators face increased rack densities and water scarcity concerns. The shift towards waterless, two-phase cooling could reduce operational costs and environmental impact, impacting data center site selection and design. Watch for increased adoption rates of such liquid cooling systems, specifically how quickly they integrate with diverse hardware from Intel, AMD, and Nvidia, and the tangible energy savings reported by early adopters at scale.
Read full article at siliconangle.com