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AI & VideoStrategic PartnershipJune 13, 2026

Google taps Intel to manufacture three million AI chips by 2028

Google taps Intel to manufacture three million AI chips by 2028
Insidermonkey

Alphabet's Google has reportedly placed an order with Intel to manufacture over three million tensor processing units (TPUs) for delivery in 2028. This significant order is expected to bolster Intel's contract chip manufacturing business, helping it compete with TSMC and support U.S.-based manufacturing initiatives. The move reflects Google's continued investment in its cloud AI infrastructure, with analysts projecting a substantial increase in data center capacity.

Key Takeaways

  • Google ordered over 3 million TPUs from Intel for 2028 delivery, shifting significant volume from traditional partner TSMC.
  • Intel's contract covers roughly half of Google's projected 6-million-unit TPU output for the 2027-2028 period.
  • The agreement follows several months of Google validating Intel's advanced packaging and EMIB interconnect technology.
  • Data center capacity for Google Cloud is projected to increase tenfold between 2022 and 2031 to meet AI demand.

Why It Matters

This partnership represents a structural shift in the AI infrastructure market, moving from a TSMC-centric manufacturing model to a multi-source strategy. For streaming and cloud providers, this supply diversification reduces the risk of hardware bottlenecks that have historically delayed the deployment of generative AI features. If Intel achieves the necessary yields on its 18A process, Google gains a secure, U.S.-based pipeline for the custom silicon powering its Gemini models. Expect other hyperscalers to evaluate similar secondary foundry options as TSMC's 2nm and 3nm capacity remains oversubscribed through 2027.

Additional Context

The order is a pivotal win for Intel Foundry, which has struggled to secure large-scale external customers despite an aggressive 'five nodes in four years' roadmap. Per Wedbush and FinancialContent reports from early 2026, Intel's 18A process node entered high-volume manufacturing in January 2026, featuring RibbonFET and PowerVia technologies. While TSMC remains the dominant producer with a 73% market share as of Q1 2026 (per Counterpoint Research), its executives admitted in June 2026 that customer demand is reaching the absolute limits of its current manufacturing capacity. Google's shift toward Intel manufacturing follows a period of rapid internal iteration on its TPU hardware. In late 2024, Google launched its sixth-generation 'Trillium' TPU, which provided a 4.7x compute increase over the previous generation. By 2025, the seventh-generation 'Ironwood' TPU reached general availability, specifically optimized for the inference requirements of Gemini 3. The reported 2028 Intel order likely targets eighth-generation or subsequent designs, which analysts expect will utilize Intel's 14A process node and EMIB packaging to scale beyond current 9,216-chip superpods. Geopolitical and domestic policy incentives are also driving this transition. According to D.A. Davidson analysts in June 2026, Google and Nvidia are under increasing pressure to align with U.S. administration goals for domestic semiconductor manufacturing. Intel has already secured Tesla as a client for its 14A process for the Terafab AI hub in Austin and is reportedly in active testing with Nvidia for its upcoming Feynman architecture. These moves suggest that the concentration of advanced logic manufacturing in Taiwan is finally being diluted by credible Western foundry alternatives.


Read full article at insidermonkey.com

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