WPM C4 Quality and Reliability Engineer

About the role

This engineer supports quality and reliability for C4 bumping processes in wafer packaging manufacturing, handling customer quality issues, excursion management, and risk assessment of nonconforming material. The role requires an on-site presence in Oregon with frequent evening meetings and 24x7 on-call rotation. A master's degree and familiarity with statistical tools such as JMP or Minitab are needed.