ADCE Packaging Design Architect

About the role

Leads end-to-end substrate design for semiconductor packages, from concept through tape-out, including physical layout, routing, and design-rule definition. Works with silicon and hardware teams on package-board co-optimization and pinout, runs fit and cost studies, and maintains design documentation in the PLM system. Requires a graduate degree, 10+ years in package or PCB design, and EDA expertise.