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Defines physical dimensions and floorplans for CPU IP blocks, optimizing die size, pin placement, and metal layer strategy, and integrates dies in packages before tape-out. Collaborates with architecture, clock, logic, and power teams. Requires hands-on Synopsys or Cadence floorplanning and place-and-route experience, plus timing closure and LVS/DRC knowledge at submicron nodes.
HQ Belgium·Hybrid