TechInsights is the most trusted source of actionable, in-depth intelligence related to semiconductor innovation and surrounding markets. The company provides reverse engineering insights, market intelligence, and supply chain analysis to empower technology companies, financial institutions, and governments. Through strategic acquisitions including Chipworks (2016) and additional purchases between 2019-2021, TechInsights has expanded its coverage to include component pricing, manufacturing intelligence, and roadmaps, serving over 650 customers worldwide.
Power your roadmap with predictive insights from TechInsights and uncover what leading semiconductor players are doing next to help you stay ahead of the curve.
TechInsights delivers critical insights that empower fabless semiconductor companies to optimize chip design, outpace competitors, and lead with innovation.
TechInsights has performed a teardown analysis of Apple's A20 Pro processor, highlighting the transition to TSMC's 2nm gate-all-around transistor architecture. The analysis details how the new chip's increased density and side-by-side memory packaging are designed to support advanced on-device AI and graphics workloads within mobile power constraints.
Power Integrations has demonstrated a 2200 V gallium nitride (PowiGaN) technology, aiming to compete with silicon carbide in high-voltage power conversion applications. The development targets infrastructure sectors including AI datacenters, industrial power, and electric vehicle architectures.
Maximize foundry performance with TechInsights’ deep analysis and strategic intelligence—empowering sharper decisions and a competitive edge at every step of production.
OpenAI has detailed the architecture of its custom Jalapeño inference chip, which utilizes a weight-stationary systolic array and a custom programming model called Gluon to optimize inference efficiency. While the chip is designed to reduce inference costs, OpenAI maintains a strategic partnership with NVIDIA for its large-scale training infrastructure.
TechInsights has completed a physical reverse-engineering analysis of Micron's 12Hi HBM3E memory package found in the NVIDIA HGX B300 accelerator. The report details the interconnect and packaging architecture of the 36GB DRAM stack, providing competitive intelligence for AI infrastructure supply chain evaluation.
TechInsights forecasts the logic packaging market will reach 144.8 billion units by 2030, with high-value growth driven by 3D GPU packaging and datacenter processors. The report highlights a shift toward application-specific packaging roadmaps, particularly for AI infrastructure and agentic AI workloads in client compute.
TechInsights published a June 24, 2026 market update on DRAM, saying stronger-than-expected demand, rising AI memory requirements, evolving procurement models, and record profitability are reshaping the cycle.
TechInsights' analysis of SK Hynix's D1c DRAM confirms its use of EUV technology, which is pivotal for advanced memory production. This technological advancement is crucial for the development of upcoming HBM4e and HBM5 memory generations. These high-bandwidth memory solutions are essential for high-performance computing, including applications in streaming infrastructure.
