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TechInsights

Website

www.techinsights.com

Contact

hr@techinsights.com

Category

Business News

Type

Publication

Blog / NewsLinkedIn
Updated Aug 24, 2026 ·

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TechInsights

TechInsights homepage screenshot

Overview

TechInsights is the most trusted source of actionable, in-depth intelligence related to semiconductor innovation and surrounding markets. The company provides reverse engineering insights, market intelligence, and supply chain analysis to empower technology companies, financial institutions, and governments. Through strategic acquisitions including Chipworks (2016) and additional purchases between 2019-2021, TechInsights has expanded its coverage to include component pricing, manufacturing intelligence, and roadmaps, serving over 650 customers worldwide.

Products & Services

Capital Equipment Semiconductor Products

Power your roadmap with predictive insights from TechInsights and uncover what leading semiconductor players are doing next to help you stay ahead of the curve.

Fabless Semiconductor Products

TechInsights delivers critical insights that empower fabless semiconductor companies to optimize chip design, outpace competitors, and lead with innovation.

Foundry Semiconductor Products

Maximize foundry performance with TechInsights’ deep analysis and strategic intelligence—empowering sharper decisions and a competitive edge at every step of production.

Integrated Device Manufacturer Products

TechInsights equips Integrated Device Manufacturers with unmatched semiconductor intelligence and strategic analysis to accelerate innovation, outperform rivals, and deliver market-leading products.

Product Manufacturer Products

Elevate your Product Manufacturer's performance with cutting-edge insights and strategic analysis.

Government Products

TechInsights provides unparalleled analysis of semiconductor technologies, supply chains, and intellectual property to support national security, regulatory compliance, and policy development.

Automotive Products

TechInsights equips you with the insights you need to successfully navigate the automotive semiconductor market.

Mobile Carrier Products

TechInsights’ Mobile Carriers product delivers in-depth analysis and data-driven insights into the strategies of global mobile network operators.

Reverse Engineering

Review how TechInsights supports the Semiconductor Industry with Technical to Market Analysis to help drive innovation, target markets, and mange cost and risk.

Product Teardown

Review how TechInsights supports the Semiconductor Industry with Technical to Market Analysis to help drive innovation, target markets, and mange cost and risk.

Market Intelligence

Review how TechInsights supports the Semiconductor Industry with Technical to Market Analysis to help drive innovation, target markets, and mange cost and risk.

Cost Analysis

Review how TechInsights supports the Semiconductor Industry with Technical to Market Analysis to help drive innovation, target markets, and mange cost and risk.

Regulatory Understanding

Review how TechInsights supports the Semiconductor Industry with Technical to Market Analysis to help drive innovation, target markets, and mange cost and risk.

IP Services

Review how TechInsights supports the Semiconductor Industry with Technical to Market Analysis to help drive innovation, target markets, and mange cost and risk.

Leadership

  • Gavin Carter

    Chief Executive Officer

  • Scotten Jones

    President and Senior Fellow

  • Dave Wein

    Chief Financial Officer

  • Graham Butler

    Chief Marketing Officer

  • Matt Cocchiaro

    Chief Revenue Officer (CRO)

TechInsights in the News

  • Aug 19, 2026
    Hardware
    NVIDIA HGX B300 memory analysis reveals Micron 12Hi HBM3E architecture

    TechInsights has completed a physical reverse-engineering analysis of Micron's 12Hi HBM3E memory package found in the NVIDIA HGX B300 accelerator. The report details the interconnect and packaging architecture of the 36GB DRAM stack, providing competitive intelligence for AI infrastructure supply chain evaluation.

  • Aug 17, 2026
    Hardware
    Advanced packaging market growth to reach 144.8 billion units by 2030

    TechInsights forecasts the logic packaging market will reach 144.8 billion units by 2030, with high-value growth driven by 3D GPU packaging and datacenter processors. The report highlights a shift toward application-specific packaging roadmaps, particularly for AI infrastructure and agentic AI workloads in client compute.

  • Jun 24, 2026
    TechInsights newsroom adds DRAM Market Update Q2 2026

    TechInsights published a June 24, 2026 market update on DRAM, saying stronger-than-expected demand, rising AI memory requirements, evolving procurement models, and record profitability are reshaping the cycle.

  • Jun 11, 2026
    Hardware
    SK hynix deploys EUV technology to anchor future high-bandwidth memory

    TechInsights' analysis of SK Hynix's D1c DRAM confirms its use of EUV technology, which is pivotal for advanced memory production. This technological advancement is crucial for the development of upcoming HBM4e and HBM5 memory generations. These high-bandwidth memory solutions are essential for high-performance computing, including applications in streaming infrastructure.

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